Publication:

Analysis of microbump induced stress effects in 3D stacked IC technologies

Date

2012
Proceedings Paper
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Author(s)

Ivankovic, Andrej
;
Van der Plas, Geert  
;
Moroz, V.
;
Choi, M.
;
Cherman, Vladimir  
;
Mercha, Abdelkarim  
;
Marchal, Pol
;
Gonzalez, Mario  
;
Eneman, Geert  
;
Zhang, Wenqi
;
Buisson, Thibault
;
Detalle, Mikael  
;
La Manna, Antonio  
;
Verkest, Diederik  
;
Beyer, Gerald  
;
Beyne, Eric  
;
Vandevelde, Bart  
;
De Wolf, Ingrid  
;
Vandepitte, Dirk

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