Analysis of microbump induced stress effects in 3D stacked IC technologies

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Authors
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk
Conference
IEEE International 3D System Integration Conference - 3DIC
Title
Analysis of microbump induced stress effects in 3D stacked IC technologies
Publication type
Proceedings paper
Embargo date
9999-12-31
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