Authors

Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Suhard, Samuel; Miller, Andy; Swinnen, Bart; Beyer, Gerald; Beyne, Eric

Conference

4th Electronics System Integration technologies Conference - ESTC

Title

Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications

Publication type

Proceedings paper