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Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications

dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorSuhard, Samuel
dc.contributor.authorMiller, Andy
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T11:57:12Z
dc.date.available2021-10-20T11:57:12Z
dc.date.issued2012-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20878
dc.sourceIIOimport
dc.titleIntegration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - imec


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