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Etch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning

dc.contributor.authorLazzarino, Frederic
dc.contributor.authorWilson, Chris
dc.contributor.authorTruffert, Vincent
dc.contributor.authorVereecke, Bart
dc.contributor.authorDemuynck, Steven
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-20T12:33:25Z
dc.date.available2021-10-20T12:33:25Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20988
dc.sourceIIOimport
dc.titleEtch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning
dc.typeMeeting abstract
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.source.peerreviewno
dc.source.beginpageC2.5
dc.source.conferenceMRS Spring Meeting Symposium C: Interconnect Challenges for CMOS Technology
dc.source.conferencedate9/04/2012
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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