Show simple item record

Copper electromigration failure times evaluated over a wide range of voiding phases

dc.contributor.authorLi, Yunlong
dc.contributor.authorCroes, Kristof
dc.contributor.authorKirimura, Tomoyuki
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-20T12:43:51Z
dc.date.available2021-10-20T12:43:51Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21019
dc.sourceIIOimport
dc.titleCopper electromigration failure times evaluated over a wide range of voiding phases
dc.typeProceedings paper
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageEM-1
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate15/04/2012
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
23525.pdf
Size:
607.1Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record