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HMM round robin study: What to expect when testing components to the IEC 61000-4-2 waveform

dc.contributor.authorMuhonen, Kathleen
dc.contributor.authorAshton, Robert
dc.contributor.authorSmedes, Theo
dc.contributor.authorScholz, Mirko
dc.contributor.authorVelghe, Rudolf
dc.contributor.authorPeachey, Nathaniel
dc.contributor.authorBarth, Jon
dc.contributor.authorStadler, Wolfgang
dc.contributor.authorGrund, Evan
dc.date.accessioned2021-10-20T13:42:15Z
dc.date.available2021-10-20T13:42:15Z
dc.date.issued2012-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21173
dc.sourceIIOimport
dc.titleHMM round robin study: What to expect when testing components to the IEC 61000-4-2 waveform
dc.typeProceedings paper
dc.source.peerreviewyes
dc.source.conferenceEOS/ESD Symposium
dc.source.conferencedate9/09/2012
dc.source.conferencelocationTucson, AZ USA
imec.availabilityPublished - imec


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