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Exploration of process window for fill of sub 30 nm features by direct plating

dc.contributor.authorNagar, Magi
dc.contributor.authorRadisic, Alex
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-20T13:47:07Z
dc.date.available2021-10-20T13:47:07Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21185
dc.sourceIIOimport
dc.titleExploration of process window for fill of sub 30 nm features by direct plating
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage2733
dc.source.conference222nd Meeting of the The Electrochemical Society: Symposium E8: Processing Materials of 3D Interconnects
dc.source.conferencedate7/10/2012
dc.source.conferencelocationHonolulu, HI USA
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2012-02


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