Optimization methods for post-bond testing of 3D stacked ICs

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Authors

Noia, Brandon; Chakrabarty, Krishnendu; Marinissen, Erik Jan

ISSN

0923-8174

Issue

1

Journal

Journal of Electronic Testing - Theory and Applications

Volume

28

Title

Optimization methods for post-bond testing of 3D stacked ICs

Publication type

Journal article

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