Process challenges in 0-level packaging using 100μm thin chip capping with TSV

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Authors
Pham, Nga; Cherman, Vladimir; Tutunjyan, Nina; Teugels, Lieve; Sabuncuoglu Tezcan, Deniz; Tilmans, Harrie
Conference
45th International Symposium on Microelectronics - IMAPS
Title
Process challenges in 0-level packaging using 100μm thin chip capping with TSV
Publication type
Proceedings paper
Embargo date
9999-12-31
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