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Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJourdain, Anne
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorWoitke, Tobias
dc.contributor.authorBisson, Peter
dc.contributor.authorGabriel, Markus
dc.contributor.authorSpiess, Walter
dc.contributor.authorGuerrero, Alice
dc.contributor.authorMcCutcheon, Jeremy
dc.contributor.authorPuligadda, Rama
dc.contributor.authorBex, Pieter
dc.contributor.authorVan den Eede, Axel
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T14:35:04Z
dc.date.available2021-10-20T14:35:04Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21302
dc.sourceIIOimport
dc.titleUltrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorVan den Eede, Axel
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.conferenceIEEE International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
imec.availabilityPublished - imec


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