Authors

Phommahaxay, Alain; Verbinnen, Greet; Suhard, Samuel; Bex, Pieter; Van den Eede, Axel; Pancken, Joris; Lismont, Mark; Jourdain, Anne; Woitke, Tobias; Bisson, Peter; Spiess, Walter; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric

Conference

IEEE 62nd Electronic Components and Technology Conference - ECTC

Title

Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down

Publication type

Proceedings paper