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Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorVan den Eede, Axel
dc.contributor.authorPancken, Joris
dc.contributor.authorLismont, Mark
dc.contributor.authorJourdain, Anne
dc.contributor.authorWoitke, Tobias
dc.contributor.authorBisson, Peter
dc.contributor.authorSpiess, Walter
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T14:36:07Z
dc.date.available2021-10-20T14:36:07Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21304
dc.sourceIIOimport
dc.titleTemporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorVan den Eede, Axel
dc.contributor.imecauthorPancken, Joris
dc.contributor.imecauthorLismont, Mark
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1255
dc.source.endpage1259
dc.source.conferenceIEEE 62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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