The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model

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Authors
Radisic, Alex; Yang, Liu; Drijbooms, Chris; Bender, Hugo
Conference
Processing Materials of 3D Interconnects, Damascene and Electronics Packaging
Title
The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model
Publication type
Proceedings paper
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