Novel interconnect methodologies for ultra-thin chips on foils

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Authors
Sridhar, A.; Cauwe, Maarten; Fledderus, H.; Kusters, R.; van den Brand, Jeroen
Conference
IEEE 62nd Electronic Components and Technology Conference - ECTC
Title
Novel interconnect methodologies for ultra-thin chips on foils
Publication type
Proceedings paper
Embargo date
9999-12-31
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