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Novel interconnect methodologies for ultra-thin chips on foils

dc.contributor.authorSridhar, A.
dc.contributor.authorCauwe, Maarten
dc.contributor.authorFledderus, H.
dc.contributor.authorKusters, R.
dc.contributor.authorvan den Brand, Jeroen
dc.date.accessioned2021-10-20T16:22:54Z
dc.date.available2021-10-20T16:22:54Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21541
dc.sourceIIOimport
dc.titleNovel interconnect methodologies for ultra-thin chips on foils
dc.typeProceedings paper
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage238
dc.source.endpage244
dc.source.conferenceIEEE 62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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