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High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

dc.contributor.authorSterken, Tom
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVermeiren, Filip
dc.contributor.authorTorfs, Tom
dc.contributor.authorWang, Liang
dc.contributor.authorPriyabadini, Swarnakamal
dc.contributor.authorDhaenens, Kristof
dc.contributor.authorCuypers, Dieter
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-20T16:28:05Z
dc.date.available2021-10-20T16:28:05Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21552
dc.sourceIIOimport
dc.titleHigh yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
dc.typeProceedings paper
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVermeiren, Filip
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorDhaenens, Kristof
dc.contributor.imecauthorCuypers, Dieter
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecCuypers, Dieter::0000-0003-0550-6273
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage940
dc.source.conference45th International Symposium on Microelectronics
dc.source.conferencedate9/09/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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