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3D stacking heterogeneous integration for devices and modules

dc.contributor.authorSun, Xiao
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T16:36:28Z
dc.date.available2021-10-20T16:36:28Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21570
dc.sourceIIOimport
dc.title3D stacking heterogeneous integration for devices and modules
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage721
dc.source.endpage726
dc.source.conferenceChina Semiconductor Technology International Conference - CSTIC
dc.source.conferencedate18/03/2012
dc.source.conferencelocationShanghai China
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 44, Issue 1


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