Test impact on the overall die-to-wafer 3D stacked IC cost

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Authors
Taouil, Mottaqiallah; Hamdioui, Said; Beenakker, Kees; Marinissen, Erik Jan
ISSN
0923-8174
Issue
1
Journal
Journal of Electronic Testing - Theory and Applications (JETTA)
Volume
28
Title
Test impact on the overall die-to-wafer 3D stacked IC cost
Publication type
Journal article
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