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Computer simulations of SiCl4/O2 ICP discharges used for coatings deposition or mask damage recovery

dc.contributor.authorTinck, Stefan
dc.contributor.authorBogaerts, Annemie
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-20T16:56:12Z
dc.date.available2021-10-20T16:56:12Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21610
dc.sourceIIOimport
dc.titleComputer simulations of SiCl4/O2 ICP discharges used for coatings deposition or mask damage recovery
dc.typeMeeting abstract
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewyes
dc.source.conferencePlasma Etch and Strip in Microelectronics - PESM
dc.source.conferencedate15/03/2012
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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