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Comparison of CF4, CHF3, and CH2F2 plasmas used for wafer processing

dc.contributor.authorTinck, Stefan
dc.contributor.authorMilenin, Alexey
dc.contributor.authorBogaerts, Annemie
dc.date.accessioned2021-10-20T16:57:05Z
dc.date.available2021-10-20T16:57:05Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21612
dc.sourceIIOimport
dc.titleComparison of CF4, CHF3, and CH2F2 plasmas used for wafer processing
dc.typeMeeting abstract
dc.contributor.imecauthorMilenin, Alexey
dc.contributor.orcidimecMilenin, Alexey::0000-0003-0747-0462
dc.source.peerreviewno
dc.source.beginpage20
dc.source.conference65th Gaseous Electronics Conference - GEC
dc.source.conferencedate22/10/2012
dc.source.conferencelocationAustin, TX USA
dc.identifier.urlhttp://meetings.aps.org/Meeting/GEC12/Event/173836
imec.availabilityPublished - imec


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