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An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

dc.contributor.authorVereecke, Guy
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorClaes, Martine
dc.contributor.authorLux, Marcel
dc.contributor.authorStruyf, Herbert
dc.contributor.authorCarleer, Robert
dc.contributor.authorAdriaensens, Peter
dc.date.accessioned2021-10-20T18:20:02Z
dc.date.available2021-10-20T18:20:02Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21775
dc.sourceIIOimport
dc.titleAn environment friendly wet strip process for 193 nm lithography patterning in BEOL applications
dc.typeMeeting abstract
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorAdriaensens, Peter
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewyes
dc.source.conferenceSEMATECH Surface Preparation and Cleaning Conference - SPCC
dc.source.conferencedate19/03/2012
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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