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Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

dc.contributor.authorWang, Bo
dc.contributor.authorTanaka, Shuji
dc.contributor.authorGuo, Bin
dc.contributor.authorVereecke, Guy
dc.contributor.authorSeveri, Simone
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorWevers, Martine
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-20T18:47:53Z
dc.date.available2021-10-20T18:47:53Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21829
dc.sourceIIOimport
dc.titleOutgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
dc.typeProceedings paper
dc.contributor.imecauthorWang, Bo
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage1
dc.source.conference19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate2/06/2012
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/document/6306325/
imec.availabilityPublished - open access


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