Multi-scale modeling of direct copper plating on resistive non-copper substrates

Thumbnail
Metadata
Show full item record
Authors
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Leunissen, Peter; Vereecken, Philippe; West, Alan
Conference
ECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects
Title
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Publication type
Meeting abstract
Collections