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Multi-scale modeling of direct copper plating on resistive non-copper substrates

dc.contributor.authorYang, Liu
dc.contributor.authorRadisic, Alex
dc.contributor.authorNagar, Magi
dc.contributor.authorDeconinck, Johan
dc.contributor.authorLeunissen, Peter
dc.contributor.authorVereecken, Philippe
dc.contributor.authorWest, Alan
dc.date.accessioned2021-10-20T19:11:36Z
dc.date.available2021-10-20T19:11:36Z
dc.date.issued2012-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21874
dc.sourceIIOimport
dc.titleMulti-scale modeling of direct copper plating on resistive non-copper substrates
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage2738
dc.source.conferenceECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects
dc.source.conferencedate7/10/2012
dc.source.conferencelocationHonolulu, HI USA
dc.identifier.urlhttp://www.ecsdl.org/getabs/servlet/GetabsServlet?prog=normal&id=MAECES001202000034002738000001&idtype=cvips&gifs=yes
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. 2012-02


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