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Mechanical characterization of micro-bump for aggressive bump scaling

dc.contributor.authorZhang, Wenqi
dc.contributor.authorMai, Zhide
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVakanas, George
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T19:38:46Z
dc.date.available2021-10-20T19:38:46Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21925
dc.sourceIIOimport
dc.titleMechanical characterization of micro-bump for aggressive bump scaling
dc.typeProceedings paper
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6542090&tag=1
imec.availabilityPublished - open access


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