Authors

Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter

Conference

China Semiconductor Technology International Conference - CSTIC

Title

Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch

Publication type

Proceedings paper

Embargo date

9999-12-31