Show simple item record

Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

dc.contributor.authorCivale, Yann
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorGuo, Wei
dc.contributor.authorBabaei Gavan, Khashayar
dc.contributor.authorJaenen, Patrick
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T06:59:49Z
dc.date.available2021-10-21T06:59:49Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22153
dc.sourceIIOimport
dc.titleVia-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
dc.typeProceedings paper
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorBabaei Gavan, Khashayar
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1420
dc.source.endpage1424
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
25487.pdf
Size:
2.586Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record