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Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVandevelde, Bart
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-21T07:09:39Z
dc.date.available2021-10-21T07:09:39Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22212
dc.sourceIIOimport
dc.titleImpact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage586
dc.source.endpage591
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access


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