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Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch

dc.contributor.authorDe Schepper, Peter
dc.contributor.authorHansen, Terje
dc.contributor.authorVaglio Pret, Alessandro
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorBoullart, Werner
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-21T07:10:38Z
dc.date.available2021-10-21T07:10:38Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22218
dc.sourceIIOimport
dc.titleLine edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch
dc.typeMeeting abstract
dc.contributor.imecauthorDe Schepper, Peter
dc.contributor.imecauthorVaglio Pret, Alessandro
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferencePlasma Etch and Strip in Microtechnology - PESM
dc.source.conferencedate14/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access


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