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Gripping-in-liquid: handling challenges for automated ultra-thin wafer production

dc.contributor.authorGiesen, Tim
dc.contributor.authorMayer, P.
dc.contributor.authorStiels, D.
dc.contributor.authorWertz, R.
dc.contributor.authorMartini, Roberto
dc.contributor.authorDebucquoy, Maarten
dc.contributor.authorVerl, A.
dc.date.accessioned2021-10-21T07:51:44Z
dc.date.available2021-10-21T07:51:44Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22400
dc.sourceIIOimport
dc.titleGripping-in-liquid: handling challenges for automated ultra-thin wafer production
dc.typeProceedings paper
dc.contributor.imecauthorDebucquoy, Maarten
dc.contributor.orcidimecDebucquoy, Maarten::0000-0001-5980-188X
dc.source.peerreviewyes
dc.source.beginpage1726
dc.source.endpage1731
dc.source.conference28th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC
dc.source.conferencedate30/09/2013
dc.source.conferencelocationParis France
imec.availabilityPublished - imec


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