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Metrology and inspection challenges for manufacturing 3D stacked IC's

dc.contributor.authorHalder, Sandip
dc.contributor.authorStiers, Karen
dc.contributor.authorMiller, Andy
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBeyne, Eric
dc.contributor.authorGuerrieri, Stefano
dc.date.accessioned2021-10-21T08:06:39Z
dc.date.available2021-10-21T08:06:39Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22453
dc.sourceIIOimport
dc.titleMetrology and inspection challenges for manufacturing 3D stacked IC's
dc.typeProceedings paper
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorStiers, Karen
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage75
dc.source.endpage79
dc.source.conference24th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate13/05/2012
dc.source.conferencelocationSaratoga Springs, NY USA
imec.availabilityPublished - imec


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