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Plasma-damage mitigation of a 2.0 PECVD porous organo silicon glass by pore stuffing

dc.contributor.authorHeyne, Markus
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorZhang, Liping
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-21T08:15:54Z
dc.date.available2021-10-21T08:15:54Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22486
dc.sourceIIOimport
dc.titlePlasma-damage mitigation of a 2.0 PECVD porous organo silicon glass by pore stuffing
dc.typeMeeting abstract
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorZhang, Liping
dc.source.peerreviewyes
dc.source.conferencePlasma Etch and Strip in Microtechnology - PESM
dc.source.conferencedate14/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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