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Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components

dc.contributor.authorJarboui, Ahmed
dc.contributor.authorCauwe, Maarten
dc.contributor.authorVermeiren, Filip
dc.contributor.authorVerplancke, Rik
dc.contributor.authorHamadi, Khemakhem
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorOp de Beeck, Maaike
dc.date.accessioned2021-10-21T08:33:43Z
dc.date.available2021-10-21T08:33:43Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22546
dc.sourceIIOimport
dc.titleParylene-C for hermetic and flexible encapsulation of interconnects and electronic components
dc.typeOral presentation
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorVermeiren, Filip
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceThe 4th Flex & Stretch Conference
dc.source.conferencedate12/11/2013
dc.source.conferencelocationEindhoven The Netherlands
imec.availabilityPublished - open access


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