dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Verbinnen, Greet | |
dc.contributor.author | Murdoch, Gayle | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | Guerrero, Alice | |
dc.contributor.author | McCutcheon, Jeremy | |
dc.contributor.author | Privett, Mark | |
dc.contributor.author | Neidrich, Jason | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-21T08:37:04Z | |
dc.date.available | 2021-10-21T08:37:04Z | |
dc.date.issued | 2013 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/22557 | |
dc.source | IIOimport | |
dc.title | Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Verbinnen, Greet | |
dc.contributor.imecauthor | Murdoch, Gayle | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | Guerrero, Alice | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Jourdain, Anne::0000-0002-7610-0513 | |
dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
dc.contributor.orcidimec | Murdoch, Gayle::0000-0002-6833-220X | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 113 | |
dc.source.endpage | 117 | |
dc.source.conference | IEEE 63rd Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 28/05/2013 | |
dc.source.conferencelocation | Las Vegas, NV USA | |
imec.availability | Published - imec | |