Show simple item record

dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorGuerrero, Alice
dc.contributor.authorMcCutcheon, Jeremy
dc.contributor.authorPrivett, Mark
dc.contributor.authorNeidrich, Jason
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T08:37:04Z
dc.date.available2021-10-21T08:37:04Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22557
dc.sourceIIOimport
dc.titleIntegration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage113
dc.source.endpage117
dc.source.conferenceIEEE 63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


Files in this item

Thumbnail

This item appears in the following collection(s)

Show simple item record