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CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies

dc.contributor.authorJourdan, Nicolas
dc.contributor.authorMachillot, Jerome
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorAi, Hua
dc.contributor.authorCockburn, Andrew
dc.contributor.authorNguyen, Mai Phuong
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorLakshmanan, A.
dc.contributor.authorMa, Paul
dc.contributor.authorNarasimhan, Murali
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T08:37:46Z
dc.date.available2021-10-21T08:37:46Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22559
dc.sourceIIOimport
dc.titleCVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies
dc.typeMeeting abstract
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorMachillot, Jerome
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2081
dc.source.conference224th ECS Fall Meeting
dc.source.conferencedate27/10/2013
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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