Show simple item record

Study of 3D process impact on advanced CMOS devices

dc.contributor.authorLa Manna, Antonio
dc.contributor.authorGuo, Wei
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorSirignano, Emilio
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T09:01:45Z
dc.date.available2021-10-21T09:01:45Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22630
dc.sourceIIOimport
dc.titleStudy of 3D process impact on advanced CMOS devices
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.conferenceEuropean Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record