Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Presentations
View item
imec Publications Repository
imec Publications
Presentations
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
View/
open
2244.pdf (1.116Mb)
Metadata
Show full item record
Authors
Vandevelde, Bart
;
Christiaens, Filip
;
Beyne, Eric
;
Van Puymbroeck, Jan
;
Heerman, M.
Conference
Eurotherm Seminar 58: Thermal Management of Electronic Systems
Title
Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
Publication type
Oral presentation
Embargo date
9999-12-31
Collections
Presentations
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login