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Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis

dc.contributor.authorVandevelde, Bart
dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeerman, M.
dc.date.accessioned2021-09-30T09:57:37Z
dc.date.available2021-09-30T09:57:37Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2267
dc.sourceIIOimport
dc.titleOptimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceEurotherm Seminar 58: Thermal Management of Electronic Systems
dc.source.conferencedate24/09/1997
dc.source.conferencelocationNantes France
imec.availabilityPublished - open access


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