Show simple item record

A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T09:31:45Z
dc.date.available2021-10-21T09:31:45Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22718
dc.sourceIIOimport
dc.titleA multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
dc.typeMeeting abstract
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceMaterials for Advances Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
26132.pdf
Size:
1.407Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record