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The need for EUV lithography at advanced technology for sustainable wafer cost

dc.contributor.authorMallik, Arindam
dc.contributor.authorVansumere, Wim
dc.contributor.authorRyckaert, Julien
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorDemuynck, Steven
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVandenberghe, Geert
dc.contributor.authorRonse, Kurt
dc.contributor.authorThean, Aaron
dc.contributor.authorVerkest, Diederik
dc.contributor.authorLebon, Hans
dc.contributor.authorSteegen, An
dc.date.accessioned2021-10-21T09:44:54Z
dc.date.available2021-10-21T09:44:54Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22754
dc.sourceIIOimport
dc.titleThe need for EUV lithography at advanced technology for sustainable wafer cost
dc.typeProceedings paper
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorVansumere, Wim
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVandenberghe, Geert
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorThean, Aaron
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.imecauthorLebon, Hans
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecVansumere, Wim::0000-0003-3093-3533
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.source.peerreviewyes
dc.source.beginpage86792Y
dc.source.conferenceExtreme Ultraviolet (EUV) Lithography IV
dc.source.conferencedate24/02/2013
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 8679


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