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Simulation of Cu pumping during TSV fabrication

dc.contributor.authorNabiollahi, Nabi
dc.contributor.authorWilson, Chris
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-21T10:18:09Z
dc.date.available2021-10-21T10:18:09Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22840
dc.sourceIIOimport
dc.titleSimulation of Cu pumping during TSV fabrication
dc.typeProceedings paper
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.conferenceIEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE
dc.source.conferencedate14/04/2013
dc.source.conferencelocationWroclaw Poland
imec.availabilityPublished - imec


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