Authors

Priyabadini, Swarnakamal; Sterken, Tom; Van Hoorebeke, Luc; Vanfleteren, Jan

ISSN

1521-3331

Journal

IEEE Transactions on Components and Packaging Technologies

Volume

3

Title

3D stacking of ultra-thin chip packages: an innovative packaging and interconnection technology

Publication type

Journal article

Embargo date

9999-12-31