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Influence of etch process sequence on damage formation in ultra low-k dielectrics

dc.contributor.authorRedzheb, Murad
dc.contributor.authorSouriau, Laurent
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-21T11:21:26Z
dc.date.available2021-10-21T11:21:26Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22990
dc.sourceIIOimport
dc.titleInfluence of etch process sequence on damage formation in ultra low-k dielectrics
dc.typeMeeting abstract
dc.contributor.imecauthorSouriau, Laurent
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecSouriau, Laurent::0000-0002-5138-5938
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferencePlasma Etch and Strip in Microtechnology - PESM
dc.source.conferencedate14/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access


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