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CVD Mn-based self-formed barrier for advanced interconnect technology

dc.contributor.authorSiew, Yong Kong
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorMachillot, Jerome
dc.contributor.authorDemuynck, Steven
dc.contributor.authorCroes, Kristof
dc.contributor.authorTseng, J.
dc.contributor.authorAi, Hua
dc.contributor.authorTang, Jing
dc.contributor.authorNaik, M.
dc.contributor.authorWang, P.
dc.contributor.authorNarasimhan, M.
dc.contributor.authorAbraham, M.
dc.contributor.authorCockburn, Andrew
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T12:02:31Z
dc.date.available2021-10-21T12:02:31Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23080
dc.sourceIIOimport
dc.titleCVD Mn-based self-formed barrier for advanced interconnect technology
dc.typeProceedings paper
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorMachillot, Jerome
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2.3
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate13/06/2013
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615551&contentType=Conference+Publications
imec.availabilityPublished - open access


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