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dc.contributor.authorLi, Li
dc.contributor.authorZou, Gang
dc.contributor.authorBender, Hugo
dc.contributor.authorMertens, Paul
dc.contributor.authorMeuris, Marc
dc.contributor.authorSchmidt, Harald
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-09-29T12:43:06Z
dc.date.available2021-09-29T12:43:06Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/230
dc.sourceIIOimport
dc.titleImprovement and evaluation of drying techniques for HF-last wafer cleaning
dc.typeProceedings paper
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.beginpage167
dc.source.endpage170
dc.source.conferenceProceedings of the 2nd International Symposium on Ultra Clean Processing of Silicon Surfaces - UCPSS
dc.source.conferencedate19/09/1994
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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