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Heated implantation with amorphous carbon CMOS mask for scaled FinFETs

dc.contributor.authorTogo, Mitsuhiro
dc.contributor.authorSasaki, Yuichiro
dc.contributor.authorZschaetzsch, Gerd
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorRitzenthaler, Romain
dc.contributor.authorLee, Jae Woo
dc.contributor.authorKhaja, Fareen
dc.contributor.authorColombeau, Benjamin
dc.contributor.authorGodet, Ludovic
dc.contributor.authorMartin, Patrick
dc.contributor.authorBrus, Stephan
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorMannaert, Geert
dc.contributor.authorDekkers, Harold
dc.contributor.authorHellings, Geert
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorThean, Aaron
dc.date.accessioned2021-10-21T12:45:58Z
dc.date.available2021-10-21T12:45:58Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23172
dc.sourceIIOimport
dc.titleHeated implantation with amorphous carbon CMOS mask for scaled FinFETs
dc.typeProceedings paper
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorRitzenthaler, Romain
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorMannaert, Geert
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorThean, Aaron
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.contributor.orcidimecRitzenthaler, Romain::0000-0002-8615-3272
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage196
dc.source.endpage197
dc.source.conferenceSymposium on VLSI Technology - VLSIT
dc.source.conferencedate10/06/2013
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6576650&tag=1
imec.availabilityPublished - open access


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