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Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects

dc.contributor.authorVan Besien, Els
dc.contributor.authorWang, Cong
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorSingh, Arjun
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorSchaekers, Marc
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVan Elshocht, Sven
dc.date.accessioned2021-10-21T13:10:44Z
dc.date.available2021-10-21T13:10:44Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23222
dc.sourceIIOimport
dc.titleDevelopment and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
dc.typeProceedings paper
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorSingh, Arjun
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.source.peerreviewyes
dc.source.beginpage105
dc.source.endpage107
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate13/06/2013
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615577&contentType=Conference+Publications
imec.availabilityPublished - imec


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