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Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
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Authors
Van Besien, Els
;
Wang, Cong
;
Verdonck, Patrick
;
Singh, Arjun
;
Barbarin, Yohan
;
Schaekers, Marc
;
Baklanov, Mikhaïl
;
Van Elshocht, Sven
Conference
IEEE International Interconnect Technology Conference - IITC
Title
Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
Publication type
Proceedings paper
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