Publication:
Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
Date
Loading...
Journal
Abstract
Description
Statistics
Views
1897 since deposited on 2021-10-21
3last month
1last week
Acq. date: 2026-04-05
Citations
Statistics
Views
1897 since deposited on 2021-10-21
3last month
1last week
Acq. date: 2026-04-05
Citations