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Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
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1890 since deposited on 2021-10-21
Acq. date: 2025-10-23
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Views
1890 since deposited on 2021-10-21
Acq. date: 2025-10-23
Citations