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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Publication:
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Date
2013
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van den Ende, Daan
;
Verhoeven, Frits
;
van der Eijnden, Pepijn
;
Kusters, Roel
;
Sridhar, Ashok
;
Cauwe, Maarten
;
van den Brand, Jeroen
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1924
since deposited on 2021-10-21
Acq. date: 2025-10-29
Citations
Metrics
Views
1924
since deposited on 2021-10-21
Acq. date: 2025-10-29
Citations